Time:2022/10/27
Author:from China Semiconductor Equipment Annual Conference
On October 27, 2022, the Forum on New Devices and New Processes Promoting the Innovation and Development of New Equipment and Materials was held in the Taihu Lake International Expo Center, Wuxi, as the concurrent forum of the 10th China Semiconductor Equipment Annual Conference. With the advancement of the integrated circuit industry, there is a high demand for new devices in the logic and storage ends, as well as in the automotive chip and biochip ends. Due to changes in device structure and interconnection processes, there are many new opportunities for equipment and materials.
The Yangtze River Delta Equipment and Materials Promotion Group was initiated and established under the guidance of the Shanghai Integrated Circuit Industry Association in March 2008. It has been held for seven consecutive sessions. The innovation ecosystem of IC equipment and materials in the Yangtze River Delta has been preliminarily constructed. Through the conference, everyone has established a system for IC equipment and materials innovation from research and development to platform, application, and capital ends, as well as the establishment of databases and expert databases.
Qin Shu, Chairman of the Yangtze River Delta Integrated Circuit Innovation Alliance and Secretary General of Jiangsu Semiconductor Industry Association, delivered a speech, believing that domestic enterprises in the field of semiconductor equipment and materials should be guided to become champions in the segmented track. Semiconductor equipment and materials are technology intensive and capital intensive, and enterprises can only achieve breakthroughs in core technologies by focusing on different tracks, solving the pain points of the domestic semiconductor equipment and materials industry, and cultivating industry advantages. And innovate the research and development mechanism of upstream and downstream cooperation. The core components and raw materials of semiconductor equipment materials in our country rely on imports, and we need to solve the problems of localization and localization.
Guo Yiwu, Secretary General of the Shanghai Integrated Circuit Industry Association, delivered a speech. According to the layout of the Shanghai integrated circuit industry, we will use Zhangjiang and Lingang as dual core drivers to layout the entire industry chain. These two regions are the areas of the entire industry chain, while Jinshan and Fengxian are the areas with a layout of two square kilometers in Jinshan and Fengxian. We also encourage each district to develop the storage, manufacturing, and research and development of electronic chemicals based on their own advantages, Enable relevant excellent enterprises to settle and develop.
Dr. Gao Xiang, Project Director of Shanghai Automotive Chip Engineering Center, introduced the progress of Shanghai Automotive Chip's development; Sun Jian, Deputy General Manager of Operations Center of China Resources Microelectronics Co., Ltd., introduced the demand for equipment and materials for power semiconductors; Liu Dahai, Procurement Director of Shanghai Xinsheng Semiconductor Technology Co., Ltd., introduced the localization progress of 300mm silicon wafer manufacturing equipment and materials; Dr. Li Xuelai, Executive General Manager of China International Capital Corporation and semiconductor analyst, analyzed the development opportunities of domestic semiconductor equipment and parts industry; Dr. Huang Jiaye, Director of the Technology and Marketing Department of Shanghai Institute of Integrated Circuit Materials, introduced how to build a first-class integrated circuit material innovation center.
Finally, a round table dialogue was held with the theme of "Core Challenges and Changes brought by Future Application Development". The guests exchanged ideas around the industrial changes derived from emerging application scenarios. For those who are mountains, based on a small piece of soil, with thousands of steep cliffs, there are both crises and opportunities. "The path is long, and the path is approaching." We rely on research and development platforms to accelerate the pace of innovation and jointly improve the resilience of the supply chain.